Ph. D Course

Mechanical Design Lab. With Advanced Materials

Department of Mechanical Engineering

E-mail :


Ph. D.Mechanical engineeringKAISTPresent
M.S.Mechanical engineeringKAISTFebruary 2018
B.S.Mechanical engineeringYeungnam UniversityFebruary 2015

Research Interest

Composite materials

Composite structures

Machine learning

Awards and Honors


  1. Jae Young Seok, Seung A Song, Inyeong Yang, Kyoohee Woo, Seong Yeon Park, Jung Hwan Park, Sanha Kim, Seong Su Kim*, Minyang Yang, “Hierarchically Porous Carbon Nanofibers with Controllable Porosity Derived from Iodinated Polyvinyl Alcohol for Supercapacitors“, Advanced Materials Interfaces, 2020;2000513
  2. Seong Yeon Park, Woe Tae Kim, Jae Hoon Choi, Seung Yoon On, Seong Su Kim*, “Effects of process-induced residual stress and geometric characteristics on pressure-resisting capability of corrugation in primary barriers of liquefied natural gas carriers.“, Ocean Engineering, 2021;237:109613
  1. Seong Yeon Park, Seung Yoon On, Seong Su Kim*,”Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package”, Composites Research, 2021;34(1): 47-50
  1. Seong Yeon Park, Seongsu Kim, “Pressure-resisting capability of the corrugated stainless-steel membrane as the primary barriers for the LNG containment system”, 2019 THE SYMPOSIUM OF SJTU-TOKYO-KAIST, 2019.10.
  2. Seong Yeon Park and Seong Su Kim, “The study on the curing process for EMC encapsulation to reduce the warpage of ultra-thin semiconductor package”,24th International Conference on Composite Structures – ICCS24, Porto, Portugal, 2021.06.
  1. Seong Yeon Park, Seong Su Kim, “ LNG 선의 1차 방벽 스테인리스 스틸 멤브레인 주름부의 내압 성능에 관한 연구”, 2019년도 기계학회 추계학술대회, 2019. 11.
  2. Seong Yeon Park, Seung Yoon On, Seong Su Kim, “Development of Manufacturing Process for EMC encapsulation of Ultra-thin Semiconductor Package”, 2020년도 한국정밀공학회, 2020. 09.
  3. Seong Yeon Park, Seung Yoon On, Seong Su Kim, “초박형 반도체 패키지의 EMC encapsulation 경화 공정 개발에 관한 연구” 2020년도 한국복합재료학회 추계학술대회, 2020. 11.
  4. Seong Yeon Park, Seong Su Kim, “LNG 선의 1차 방벽 주름부의 내압 성능 분석을 위한 잔류응력 및 기하학적 형상에 관한 연구”, 2021년도 대한기계학회 추계학술대회, 2021.11
  5. Seong Yeon Park, Seong Su Kim, “초박형 반도체 패키지의 휨을 줄이기 위한 EMC 경화 공정 개발에 관한 연구” 2021년도 한국복합재료학회 추계학술대회, 2021. 11.
  1. Seong Yeon Park, Woe tae Kim, Chang-seon Bang, Jong Gyu Lee and Seong Su kim, “INTERNAL PRESSURE PERFORMANCE TEST DEVICE FOR STEEL”, Korea Patent Pending, No.10-2021-0134692, 2021