Seongyeon Park

Seongyeon Park

Ph. D Course

Education

Ph.D. Mechanical engineering KAIST Present
M.S. Mechanical engineering KAIST February 2018
B.S. Mechanical engineering Yeungnam University February 2015

Research Interest

Composite materials
Composite structures
Machine learning
1 Jae Young Seok, Seung A Song, Inyeong Yang, Kyoohee Woo, Seong Yeon Park, Jung Hwan Park, Sanha Kim, Seong Su Kim*, Minyang Yang, “Hierarchically Porous Carbon Nanofibers with Controllable Porosity Derived from Iodinated Polyvinyl Alcohol for Supercapacitors“, Advanced Materials Interfaces, 2020;2000513
2 Seong Yeon Park, Woe Tae Kim, Jae Hoon Choi, Seung Yoon On, Seong Su Kim*, “Effects of process-induced residual stress and geometric characteristics on pressure-resisting capability of corrugation in primary barriers of liquefied natural gas carriers.“, Ocean Engineering, 2021;237:109613
3 Wonvin Kim, Su Hyun Lim, Hyunsoo Hong, Kwang Il Jeong, Seung Yoon On, Seong Yeon Park, Jun Il You, Seong Su Kim*, “Optimum boundaries for maximum load-carrying capacity in water-lubricated composite journal bearings incorporating turbulences and inertial effects based on elastohydrodynamic analysis”, Journal of Computational Design and Engineering, 2022.
4 Seung Yoon On, Hyemi Moon, Seong Yeon Park, Tae Woong Ohm, Wonvin Kim, Hyunsoo Hong, Seong Su Kim*, "Design of periodic arched structures integrating the structural nonlinearity and band gap effect for vibration isolation”, Materials & Design, 2022.
5 Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L. Wardle*, and Seong Su Kim*, “Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles“, ACS Appl. Mater. Interfaces 2023, 15, 8, 11024–11032
1 Seong Yeon Park, Seung Yoon On, Seong Su Kim*,”Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package”, Composites Research, 2021;34(1): 47-50
1 Seong Yeon Park, Seongsu Kim, “Pressure-resisting capability of the corrugated stainless-steel membrane as the primary barriers for the LNG containment system”, 2019 THE SYMPOSIUM OF SJTU-TOKYO-KAISTSeong Yeon Park, Seongsu Kim, “Pressure-resisting capability of the corrugated stainless-steel membrane as the primary barriers for the LNG containment system”, 2019 THE SYMPOSIUM OF SJTU-TOKYO-KAIST 2019.10.
2 Seong Yeon Park and Seong Su Kim, “The study on the curing process for EMC encapsulation to reduce the warpage of ultra-thin semiconductor package”,24th International Conference on Composite Structures – ICCS24, Porto, Portugal 2021.06.
3 Seong Yeon Park, Seong Su Kim. “Electronic packaging enhancement engineered by enhancing the reliability via rapid cooling” - The 9th international conference of Asin Society for Precision Engineering and Nanotechnology 2022 (ASPEN 2022), Singapore 2022.11.
4 Seong Yeon Park, Seong Su Kim. “Preprocess-induced residual stress and geometric characteristics on pressure resisting capability of corrugated shape in primary barriers of liquefied natural gas carriers” - The asia-pacific conference on fracture and strength ans the conference on structural integrity and failure 2022 (APCFS/SIF 2022) South australia. 2022.12.
1 Seong Yeon Park, Seong Su Kim, “ LNG 선의 1차 방벽 스테인리스 스틸 멤브레인 주름부의 내압 성능에 관한 연구”, 2019년도 기계학회 추계학술대회 2019. 11.
2 Seong Yeon Park, Seung Yoon On, Seong Su Kim, “Development of Manufacturing Process for EMC encapsulation of Ultra-thin Semiconductor Package”, 2020년도 한국정밀공학회Seong Yeon Park, Seung Yoon On, Seong Su Kim, “Development of Manufacturing Process for EMC encapsulation of Ultra-thin Semiconductor Package”, 2020년도 한국정밀공학회 2020. 09.
3 Seong Yeon Park, Seung Yoon On, Seong Su Kim, “초박형 반도체 패키지의 EMC encapsulation 경화 공정 개발에 관한 연구” 2020년도 한국복합재료학회 추계학술대회 2020. 11.
4 Seong Yeon Park, Seong Su Kim, “LNG 선의 1차 방벽 주름부의 내압 성능 분석을 위한 잔류응력 및 기하학적 형상에 관한 연구”, 2021년도 대한기계학회 추계학술대회 2021.11
5 Seong Yeon Park, Seong Su Kim, “초박형 반도체 패키지의 휨을 줄이기 위한 EMC 경화 공정 개발에 관한 연구” 2021년도 한국복합재료학회 추계학술대회 2021. 11.

Example content 3

1 Seong Yeon Park, Woe tae Kim, Chang-seon Bang, Jong Gyu Lee and Seong Su kim, “INTERNAL PRESSURE PERFORMANCE TEST DEVICE FOR STEEL”, Korea Patent Pending, No.10-2021-0134692 2021
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